61 ipc-1601 bixenman results

3D ICs With TSVs - Design Challenges And Requirements

3D ICs With TSVs - Design Challenges And Requirements

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness

| https://www.eptac.com/blog/ipc-medical-industries-technical-conference-lead-free-reliability-readiness

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness Looking for solder training standards, manuals, kits, and more

*Stewart McCracken, MCS Ltd *Mike Bixenman, MBA, DBA, Magnalytix REGISTRATION Professional Development Course 1 REGISTRATION Session 1

40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf

Surface Mount Technology Association (SMTA)

40731