Industry Directory | Manufacturer
professional manufacturer of pcb
Industry Directory | Manufacturer
Board Electronics Co.,Ltd is a reputed quick-turn prototyping and small to medium volume PCB supplier in China. Our products cover all PCB areas, including rigid, flex and rigid-flex circuit boards
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Electronics Forum | Wed Jul 20 13:47:42 EDT 2005 | russ
IPC has this. I cannot remember which one, Here is what I do for a quick reference. square pin - add .015" to the pin dimension e.g. .025" square pin gets a .040" hole. OR if the pins are large get the max dimension )e.g. a .025" square pin has
Electronics Forum | Thu Jul 21 22:14:34 EDT 2005 | Ken
Anyone else disagree with IPC-2222 for min-lead to max hole in the application of ribbon lead connector styles?
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/
. When you transition to lead-free soldering, you will have to make some changes in the already established PCB-design rules. To guarantee manufacturability and dependability, industry guidelines regulate component lead-pad and land size, track width and spacing, via and through-hole dimensions, and other variables
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/280mm-squeegee-blade-with-hole-141514?page=36&category=1113
DEK SQUEEGEE BLADE (with hole) 280mm | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products DEK SQUEEGEE BLADE (with hole