Industry Directory: minimum via (6)

Ludee Circuits

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other

Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.

TRC Circuits Inc

Industry Directory | Consultant / Service Provider / Manufacturer

TRC Circuits provides high quality printed circuit boards to a wide range of industries. We have 23 years of experience manufacturing printed circuit boards.

New SMT Equipment: minimum via (30)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: minimum via (51)

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

Used SMT Equipment: minimum via (15)

Ekra X5 Professional Large

Ekra X5 Professional Large

Used SMT Equipment | Screen Printers

EKRA X5 Professional Large, Screen and Stencil Printer Type: X5 Prof Large Serial Nr.: 805843 Year of Manufacture: 2014 Direction: Left to Right Voltage: 400V, 50/60Hz, 3 Phases Air Pressure: 6 Bar Printing Area: min.: 80x50mm, max.: 660x550mm Printe

smtXtra

Rohde & Schwarz CMW500

Rohde & Schwarz CMW500

Used SMT Equipment | General Purpose Test & Measurement

The R&S CMW500 marks the entry of a new generation of test equipment from Rohde & Schwarz for fast and precise production of current and future wireless devices. The R&S Smart Alignment high-speed test concept plus the all-in-one architecture with

Test Equipment Connection

Industry News: minimum via (59)

Technical Library: minimum via (2)

Impact of Assembly Cycles on Copper Wrap Plating

Technical Library | 2020-07-22 19:39:05.0

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.

Firan Technology Group

A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability

Technical Library | 2021-07-20 20:02:29.0

During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.

NASA Office Of Safety And Mission Assurance

Videos: minimum via (35)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

PCB separator|PCB cutting machine |PCB automatic separator

PCB separator|PCB cutting machine |PCB automatic separator

Videos

http://www.pcb-separator.com/plus/view.php?aid=86 ??????????? ???????? ????/LED separating/LED panel separating/PCB depaneling device/???????/online separating

ASCEN Technology

Training Courses: minimum via (3)

CES for Expedition PCB

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Mentor Graphics

Career Center - Jobs: minimum via (16)

Manufacturing Engineer

Career Center | , Massachusetts | Engineering

we are looking for a mechanical engineer with the following qualifications: * BSME * US Citizenship * Pro-Engineer / Pro-Mechanica experience * Military electronics packaging background * Thermal and Structural Analysis (Shock, Vibe) analys

Hire-Logic

SMT Machine Operator

Career Center | Valley View, Ohio USA | Production

Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en

Manpower Professional

Career Center - Resumes: minimum via (1)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: minimum via (190)

Partner Websites: minimum via (392)

SolderTips: Avoiding the Creation of Splices Via Wire Twisting | EPTAC

| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

SolderTips: Avoiding the Creation of Splices Via Wire Twisting | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

Conformal Coating Dispense Systems

GPD Global | https://www.gpd-global.com/co_website/pdf/coating/SimpleCoat-System-Overview.pdf

• Internal Black Light for Coating Inspection • Keyed Maintenance Mode • Light Tower Selective Conformal Coating Machines SimpleCoat & SimpleCoat TR Cost-effective Solutions for Conformal Coating Programming via JPG image (before and after

GPD Global


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