Electronics Forum | Wed Jan 30 05:36:04 EST 2002 | vincent_f
Hello everybody, I would like to use PCB which have expired. I have already planned to bake them in order to avoid pop corn effect but I wonder about some few items : 1) How can I identify the optimal baking parameters ? 2) Even after baking, is the
Electronics Forum | Tue Dec 24 17:06:00 EST 2002 | MA/NY DDave
Hi, Lots of good answers and I am sure questions in the above. I have too many questions to really know whether your idea is a good one, as it could be, or one that will cause you more problems. Based on the size of the PWB that you will buy and t
Technical Library | 2013-06-05 23:14:44.0
The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process.
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Raleigh, North Carolina USA | Engineering
Title: SMT PROCESS ENGINEER Salary: 70k-80k max rate with great benefits Job Description: ESSENTIAL DUTIES & RESPONSIBILITIES To perform this job successfully, an individual must be able to perform each essential duty satisfactorily, plus w
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Inspecting PWB Assemblies for Defects Bob Wettermann $25.00 2018 ESD Electrostatic Discharge Guide for Everyone SMTA Europe $25.00 2018 Jump Start - An Introduction to SMT Process Basics and Troubleshooting
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
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