Industry Directory: reduce the void with vacuum reflow (1)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

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New SMT Equipment: reduce the void with vacuum reflow (11)

ERSA EXOS 10/26, Inline reflow soldering with vacuum

ERSA EXOS 10/26, Inline reflow soldering with vacuum

New Equipment | Reflow

With the EXOS 10/26, Ersa offers a vacuum reflow soldering system with eleven heating zones, three heating circuits for the vacuum chamber and four cooling zones for extremely voidfree connections in electronics production. The absolute highlight

kurtz ersa Corporation

Beijing TORCH RS220 vacuum Reflow Oven for Lamp Welding / IGBT / Power Laser / Semiconductor laser with 1% void rate

Beijing TORCH RS220 vacuum Reflow Oven for Lamp Welding / IGBT / Power Laser / Semiconductor laser with 1% void rate

New Equipment | IC Packaging

Function Introduction: 1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven. It especially designed for the fields in small batch production, R&D and functional materails test, etc

Beijing Technology Company

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Electronics Forum: reduce the void with vacuum reflow (23)

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 07 10:13:06 EDT 2019 | cyber_wolf

I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers

Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.

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Used SMT Equipment: reduce the void with vacuum reflow (1)

Heller 1936MK7

Used SMT Equipment | Soldering - Reflow

Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional

SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,

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Industry News: reduce the void with vacuum reflow (96)

HELLER Convenes a Successful 2024 Sales Kickoff Meeting, Setting the Stage for a Strong Year Ahead

Industry News | 2024-02-26 16:22:08.0

HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.

Heller Industries Inc.

HELLER'S High UPH Vacuum Oven Wins the "17th Step-by-Step Excellence Awards"

Industry News | 2023-10-18 17:43:18.0

HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.

Heller Industries Inc.

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Technical Library: reduce the void with vacuum reflow (6)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

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Videos: reduce the void with vacuum reflow (6)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Ersa Reflow Soldering with vacuum: EXOS 10/26

Ersa Reflow Soldering with vacuum: EXOS 10/26

Videos

With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr

kurtz ersa Corporation

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Events Calendar: reduce the void with vacuum reflow (1)

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Surface Mount Technology Association (SMTA)

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Express Newsletter: reduce the void with vacuum reflow (957)

SMTnet Express - October 3, 2018

SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints

SMTnet Express - April 7, 2022

SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a

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reduce the void with vacuum reflow searches for Companies, Equipment, Machines, Suppliers & Information

The Branford Group
The Branford Group

A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.

Manufacturer / Equipment Dealer / Broker / Auctions

896 Main Street
Branford, CT USA

Phone: 203-488-7020