Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Consultant / Service Provider / Manufacturer
Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Sun Aug 15 04:43:15 EDT 2004 | Danish
Can anyone advise how to measure flatness of a surface?Flatness on top of IC..
Electronics Forum | Mon Aug 16 09:17:13 EDT 2004 | russ
For flatness - Put the part on a leveling plate and roll a dial indicator across it. The leveling plate is not required for a true flatness check but using this will also work for parallelism of lead base to top of body.
Used SMT Equipment | General Purpose Equipment
Apply The Flat Belt Conveyor is used for smooth transfer of PCBs when edged conveyors can not be used. It can be made to meet customer's requirements, it is available in any length and width. Features 1. No PLC control, or PLC and sen
Used SMT Equipment | In-Circuit Testers
Megger DET14C Clamp-on Ground Resistance Testers The DET14C and DET24C are advanced clamp-on ground resistance testers that set new standards in terms of access, performance, features, simplicity of operation and safety. These units are designe
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
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Parts & Supplies | Pick and Place/Feeders
FUJI IPG510 BELT FUJI IPG519 BELT FUJI IPG5190 BELT FLAT (BU-6A-1530MM) (BU-6A-1530mm) FUJI IPH0540 BRUSH HOLDER FUJI IPH0560 SPRING FUJI IPH0570 GUIDE BAR FUJI IPH1500 GEAR FUJI IPH1530 GEAR ASSY FUJI IPH1540 GEAR FUJI IPH1542 GEAR FUJI IP
Parts & Supplies | Assembly Accessories
FUJI Spare Parts List 1. AJ64207 NXT Flat cable 2. AJ13203 Harness Flat, Cable Type3 3. AJ13111 Harness Flat, Cable Type2 4. AJ13C00 Harness Flat, Cable Type1 5. AJ92604 Harness Flat, Cable Type2 6. AJ92805 Harness Flat, Cable Type4 7. AJ927
Technical Library | 2019-10-03 14:27:01.0
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage.
Technical Library | 2016-09-22 17:52:59.0
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal coatings are often qualified to international standards, intended to enable users to better differentiate between suitable conformal coating chemistries, but always on a flat test coupon, which is not representative of real world use conditions. In order to better correlate international standards with real world-use conditions, three-dimensional Surface Insulation Resistance (SIR) test boards have been manufactured with dummy components representative of those commonly used on printed circuit assemblies...
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Events Calendar | Wed Sep 11 00:00:00 EDT 2019 - Fri Sep 13 00:00:00 EDT 2019 | Ho Chi Minh City, Vietnam
NEPCON Vietnam - SMT, Testing Technologies Expo
Events Calendar | Wed Jun 19 00:00:00 EDT 2019 - Sat Jun 22 00:00:00 EDT 2019 | Bangkok, Thailand
NEPCON Thailand - Assembly, Measurement and Testing Technologies for Electronics Manufacturing Expo
Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support
Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
to assemble reliable surface mount attached techno
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/micro-materials-tester?con=t&page=8
Camera-assist_automation_NordsonDage Nordson DAGE Surface-Flatness-and-Bond-Thickness-Measurement-Methods-Using-the-Acoustic-Microscope-SMTA-2012-JES Nordson Corporation First
ORION Industries | http://orionindustries.com/pdfs/SILPAD900S.pdf
. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
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