New SMT Equipment: switch failure due to flux (3)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: switch failure due to flux (4)

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson

Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part

Re: White Residue / Vapor Degrease

Electronics Forum | Mon Jan 18 21:05:15 EST 1999 | Dave F

| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi

Industry News: switch failure due to flux (26)

Debbie Carboni, KYZEN Corporation, to Present at SMTA Capital Chapter Meeting on June 10th

Industry News | 2021-05-25 12:56:56.0

The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:

Surface Mount Technology Association (SMTA)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Videos: switch failure due to flux (3)

Lead Free Reflow Oven

Lead Free Reflow Oven

Videos

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

Dongguan Intercontinental Technology Co., Ltd.

SMD Reflow Oven

SMD Reflow Oven

Videos

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: switch failure due to flux (631)

Partner Websites: switch failure due to flux (100)

How to operate the safety interlock of Hanwha Chip Mounter correctly?-SMT Technical-Reflow oven,SMT

| http://etasmt.com/cc?ID=te_news_industry,22761&url=_print

.). ²  Defects due to ambient conditions (moisture, impurities, dust on the machine, oil mist, etc.). ²  When failure occurs to the machine due to customer's mistake

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

. Solder-Starved Joint A   solder-starved joint   is just that: a joint that does not have enough solder. Despite making the necessary electrical contact, the insufficient solder weakens the joint and increases susceptibility to cracking and failure


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