Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
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Protection Reflow Oven From: Author: Publish time:2021-09-01 09:44 Clicks:2 Lead-free era makes whether need nitrogen in reflow a hot topic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
activators. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin
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