New SMT Equipment: 20 mil (Page 1 of 11)

Hand Soldering Training

Hand Soldering Training

New Equipment | Education/Training

The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo

Blackfox Training Institute, LLC

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

HDI PCB, High density PCB, High density interconnect PCB, HDI PCB Manufacturing -- Hitechpcba

New Equipment | Fabrication Services

HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri

Hitech Circuits Co., Limited

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

Rogers PCB

Rogers PCB

New Equipment | Components

Bicheng provides R&D, high-tech, IT research companies and organizations large or small with  high frequency RF/microwave PCB's. Technical parameters: *NPTH and PTH( 20 um)             *Thermal stress: 288C/10sec             *Permitivity: ER2.1-1

Bicheng Enterprise Company

Flex and Rigid-Flex Circuits

New Equipment |  

Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.

Speedy Circuits, div. of PJC Technologies, Inc.

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

AMTECH BGA Solder Spheres

AMTECH BGA Solder Spheres

New Equipment | Solder Materials

AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N

AMTECH

ENIG FR4 Power supply PCB shenzhen maker

ENIG FR4 Power supply PCB shenzhen maker

New Equipment | Prototyping

4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB

Shenzhen SYS Technology CO., Ltd

Rogers 4003 PCB assembly

New Equipment | Assembly Services

Rogers material used for high frequency ,you can get all types of material from us and assembly . This is a 4 layer wtih RO 4003  20mil.0402 chip loading. Pls contact us for your next job.

Storm Circuit Technology Ltd

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