New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
Ceramic -based Board
Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.
Layer count: Single-sided PCB Board thiness: 0.8MM Copper thiness: 1oz Dielectric constant(DK): 3.48 Surface treatment: Immersion gold
The Flo-master BGA/SMT rework and repair system is a fully integrated dual, top and bottom heat system designed to handle ceramic BGA's, military type boards and commercial applications requiring an efficient level of power versus temperature
Rogers 4350 PCB/Ceramic PCB Layer count: Single-sided PCB Board thickness: 0.8mm Copper thickness: 1oz Dielectric Constant(DK): 3.48 Surface treatment: Immersion Gold
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in process setup and new product introduction in the PCB or Hybrid Microcircuit assembly industries. ScanINSPECT VPI
