New SMT Equipment: data transfer module (Page 1 of 57)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Ersa HOTFLOW 3/14e Reflow Oven

Ersa HOTFLOW 3/14e Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 3/14e Reflow Oven Working width: 45-516 mmProcess length: 3,345 mmHeated length: 2,610 mmCooling length: 735 mmWeight appr. 1,450 kgDimension: 4,770x1,201x1,375 mm   Ersa HOTFLOW 3/14e Reflow Oven Ersa HOTFLOW 3/14e Reflow Oven Dua

Qersa Technology Co.,ltd

Ersa HOTFLOW 3/20e SMT Reflow Oven

Ersa HOTFLOW 3/20e SMT Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 3/20e SMT Reflow Oven Working width: 45-516 mm Process length: 4,840 mm Heated length: 3,725 mm Cooling length: 1,115 mm Weight appr. 1,900 kg Dimension: 6,265x1,201x1,375 mm Ersa HOTFLOW 3/20e SMT Reflow Oven Ersa HOTFLOW 3/20e S

Qersa Technology Co.,ltd

Ersa HOTFLOW 3/20 SMT Reflow Oven

Ersa HOTFLOW 3/20 SMT Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 3/20 SMT Reflow Oven Working width: 45-580 mmProcess length: 5,190 mmHeated length: 3,700 mmCooling length: 1,490 mmWeight appr. 3,200 kgDimension: 6,590x1,530x1,450 mm   Ersa HOTFLOW 3/20 SMT Reflow Oven Ersa HOTFLOW 3/20 SMT Refl

Qersa Technology Co.,ltd

Heller 1707 MK7 SMT Reflow Oven

Heller 1707 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm   Heller

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

EasyCoat 6 Conformal Coating Software

EasyCoat 6 Conformal Coating Software

New Equipment | Software

EasyCoat® 6 software for conformal coating systems delivers intuitive visual programming Nordson ASYMTEK's EasyCoat® software provides precise conformal coating with process control, traceability, and intuitive visual programming for conformal coati

ASYMTEK Products | Nordson Electronics Solutions

10 Zones Economical SMT Reflow Oven KTE-1000

10 Zones Economical SMT Reflow Oven KTE-1000

New Equipment | Reflow

10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z

Flason Electronic Co.,limited

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Hanwha DECAN S2 Assembly line

Hanwha DECAN S2 Assembly line

New Equipment | Other

Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH  INQUIRY Ha

Flason Electronic Co.,limited

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