Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
New Equipment | Solder Materials
Kapp Alumite fluxless Aluminum soldering & brazing rod for the fabrication, maintenance and repair of cast Aluminum and Zinc alloys. Alumite has been used and endorsed by leading cast Aluminum, diecast and white metal manufacturers for over 60 years!
New Equipment | Board Handling - Conveyors
This Rack Buffer Stocker, installed between the main equipment, is an in-line device that minimizes the downstream process line#25;'s waiting time, and feeds and discharges boards in the first-in-first-out process. FEATURES: Minimizes defectiv
High-Mix, Medium Volume Automated Optical Inspection The Supra E is the class-leading, cost effective solution for all PCB manufacturers with PCBs up to 20” x 20”. MVP’s Quad-Color technology provides the ability to use multiple angles of light t
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
• Automatic operation without Contact: Ring Setting, Diameter Inspection, Effective Drill Bit Length Inspection. • Unique Image Processing Technology: Inspection automatically & check the defective drill bit. • The carry box can comply with all diffe
The Agilent Medalist 5DX Series 5000 offers 3-D Automatic X-Ray inspection capability, enabling inspection of both sides of a double-sided panel in one pass. Customer CAD is converted to an inspection program, enabling 100% solder joint inspection t
Eliminate Human Error During the Changeover and Assembly Process. The Process Monitor Device (P.M.D.) is designed to eliminate human error during the change over and assembly process. The system will monitor all part errors. On the operator screen,
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
