APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
We have a large on-hand inventory of Dicing Saws and parts. We would like for you to view our machines on our website: http://www.eartechnology.com
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
NGA provides complete Micro automation dicing saw models 1006 and 1100 support. We rebuild Saws by doing a complete overhaul of the machine replacing neccessary parts to make the machine function like new. We have available spare parts for sale. W
The LDS 200 A is a fully automatic, cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness). For more information please visit our website
Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
Spindles and Spindle Parts for PCB Routing Machines. KLKJ established its air bearing and ball bearing spindle repair service for the P.C.B. drilling and dicing industry in 1999 in China, backed by experienced technicans and advanced equipment. Wit
Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
