New SMT Equipment: hi rel rosin flux cleaning process (Page 1 of 3)

Decotron C55S

New Equipment |  

is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros

DCT Cleaning

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

Cored Solder Wire

Cored Solder Wire

New Equipment | Solder Materials

Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most re

Shenmao Technology Inc.

IONOX® BC - Semi-Aqueous Solvent Electronics Cleaner

IONOX® BC - Semi-Aqueous Solvent Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur

KYZEN Corporation

ALPHA® Liquid Soldering Flux

ALPHA® Liquid Soldering Flux

New Equipment | Solder Materials

ALPHA® EF-Series fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA soldering flux line is unsurpassed in providing wave soldering process solutions. Its alcohol-based fluxes provide excellent w

MacDermid Alpha Electronics Solutions

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

New Equipment | Cleaning Agents

CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS

KYZEN Corporation

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

ALPHA® Cored Wire

ALPHA® Cored Wire

New Equipment | Solder Materials

Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies.  The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys.  A

MacDermid Alpha Electronics Solutions

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

CYBERSOLV® 141-R - Precision Aerosol Cleaner

CYBERSOLV® 141-R - Precision Aerosol Cleaner

New Equipment | Cleaning Agents

CYBERSOLV® 141-R is a precision cleaner blend of organic solvents that is safe and ready to use for bench-top electronics cleaning. CYBERSOLV® 141-R is effective on a wide variety of soils typically found in electronic assembly and maintenanc

KYZEN Corporation

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