New Equipment | Solder Materials
DKL Metals have recently introduced their latest generation of Partner Paste formulations which have been designed specifically for use in Lead Free soldering. These pastes all give excellent print and reflow characteristics, tack life and stencil li
FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu
FMEA-Pro� 5 is a revolutionary software tool that enables you to perform a Failure Modes and Effects Analysis of manufactured products from the automotive, aerospace, defense and consumer electronics industries, to name just a few. This program is fu
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
Lead Tinning is an important aspect when components need to withstand adverse conditions for extended periods. Lead Tinning can also be used in the restoration of corroded components to their original condition. V-TEK meets or exceeds Mil standards.
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
Sunshine manufactures the most advanced stencils powered by LPKF's laser Technology. By combining our experience with the newest technology, we produce unrivaled results Laser stencil specifications: Resolution 0.5 mm Axial Precision �4μm
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
