Stencils, metal mask tools used for the deposit of solder paste onto PC Board before component placement. Please call for the best process for your requirements.
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
Used on SMT machinery i.e. DEK, MPM, EKRA, Panasonic etc., to clean residual solder paste
Solder Paste Inspection and Measurement System, providing 100 % 2 D and sampled 3 D coverage.
Stencils For Solder Paste Or Adhesive Printing. Chemically Etched, Laser Cut Or Combination Laser/Chem.
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
Advanced Automated Optical Inspection equipment utilizing �Line Sensor Scanning� not the common strobe/camera technology. BF Series inline system offers post paste, bond, place and reflow inspection. The �Hero� off-line bench top model is also avai
The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.
