Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature
New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Solder Materials
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
New Equipment | Soldering Robots
The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality inspection are required. A motorized, five position ind
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
