New SMT Equipment: void qfn dek printing (Page 1 of 1)

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

X2.5L Automated X-Ray System for High-speed Final Inspection

X2.5L Automated X-Ray System for High-speed Final Inspection

New Equipment | Inspection

Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies. The X2.5L is based on the well-established MatriX X2.5 system series. It is configured with a new generation of TDI X-ray cameras

MatriX Technologies GmbH

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