Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Fri Apr 30 10:39:15 EDT 2004 | Bryan She
I found much ICT fails on the same location(Ref.des:Q166) on my boards. 1.Defects rate:more than 20%. 2.We measured the value of the transistor before reflow oven,it's ok.but measure again after been reflowed,result is fail.it seems fails happen duri
Electronics Forum | Mon May 25 04:51:44 EDT 2009 | microdot
hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small pcb. the picture i have enclosed is used to remove the but when we tried to solder the chip using the same profile..it didnt work. Can anybody suggest
Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa
We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Mon Mar 08 15:17:50 EST 2004 | Robert
Need some suggestions on oven profile. I run a BTU VIP98 oven. Has 7 zones, convention heat and all. My profile goes (in Celcius) 150/160/170/180/205/215/180 moving at 28in/min. Roughly 5 minutes from start to finish. I use Kester 256 solder and my b
Electronics Forum | Tue Apr 02 14:56:30 EDT 2024 | kingkelvin
Hi all - my problem is a bit worse now - I can get all hydra tests to pass in extended service, except indicator levels at current 7 a bit high past 190 limit at ~210-220 - other than that hydra bank re-installs OK - but still it makes a bad hitting
Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Thu May 14 21:46:27 EDT 1998 | D.Lange
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
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