Electronics Forum | Thu Aug 24 16:44:27 EDT 2000 | Dr. Ning-Cheng Lee
There is no IMC composition can be identified in phase diagram of In/Sn. There are some compositions such as In3Sn or InSn4 cited in earlier literature. Those composition should be regarded as approximate representation of solid solution of In/Sn. I
Electronics Forum | Thu Dec 19 12:08:01 EST 2002 | davef
Facts!!! I got facts. Mechanical strength experiments of Sn43/Pb43/Bi14: �Microstructural And Mechanical Characterization Of 43/43/14 Tin/Lead/Bismuth�; J. Marshall, J. Calderon, J. Sees; Soldering And Surface Mount Technology; 10/91, p25-27 Look
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
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