Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ
We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.
Electronics Forum | Thu Aug 19 05:12:41 EDT 2004 | bernardmulcahy
Hi Russ, Thanks for the reply -- It is not a double sided board so I guess I will be doing pretty much the same process as you described. I was wondering about was the tool you mentioned -- Is this just a fixture you got made locally or some specific
Electronics Forum | Wed Aug 18 20:09:45 EDT 2004 | df_indy
Hello, We want to build in-house cross sectioning capability. I have a general idea of the process and equipment required, but I do not know any brand names to start with. I wish I had written down the equipment model name when I visited our suppli
Electronics Forum | Thu Aug 19 13:29:43 EDT 2004 | davef
Things we�d like to have in a reflow oven are: * Small variation in temperature [+-2*C] from rail-to-rail. * Consistent temperature over time [3+ sigma]. * Thermal inertia / fast recovery to be able to respond to the effects of high mass boards. * Ra
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Wed Aug 25 03:28:15 EDT 2004 | alexei_shk
You are wrong. Files from MYData can be uploaded through network to PC with Windows. But I get text files and realy it have codes that I need to know. For example: In panel file I have codes like P1, P2, P3 and so on. In PCB file I have codes like F1
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Tue Aug 24 09:39:03 EDT 2004 | V
I feel your pain as well. Our purchasing group minimizes the amount of material in inventory so of course they bring in only what is absolutely needed. When they see 10,000 components in house they just don't understand that the part may be used on
Electronics Forum | Tue Aug 24 12:36:45 EDT 2004 | Cal
Hey Dave I deal with this every day. UGH!!!! We created a Bin location for each of our pick-and-place machines. Once the parts are moved from stock the computer will be updated as SMT 01xxx, SMT 02, and SMT 03 Bin location for that part. SMT01-03 are
