Electronics Forum | Tue Aug 03 18:11:21 EDT 2004 | davef
Improper washing of water soluable flux residues can be a major contributor to flux residues remaining on the board surface. ;-O That you appear to be only complaining about the pathetic state of the ability of your washer to clean under BGA, it may
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Fri Aug 06 15:32:03 EDT 2004 | Shean Dalton
Thanks for providing the pictures. We evaluated what we could see and have the following idea's. 1) Because of different thermal charatoristics between the topline and your product, your Motorola BGA solder joints may have experienced a higher refl
Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Tue Aug 10 15:28:54 EDT 2004 | Shean Dalton
Because the HASL process most deal with bare metals, HASL flux residues are generally more active than solder paste residues. Typically a Rosin Active (RA) flux is used in the HASL process. These flux residues should be removed from the bare board
Electronics Forum | Wed Aug 04 00:17:41 EDT 2004 | Shean Dalton
Additionally, increases in temperature can increase the water's rate of reaction with the flux. Sometimes, only a 5 degree change can make the cleaning difference. If the flux inconsistently presents itself, then the likely cause is something in
Electronics Forum | Fri Jan 29 21:31:46 EST 2010 | aqueous
I would recommend the following paper entitled "Cleaning for Reliability Post QFN Rework" by Mike Bixenman (Kyzen) and myself (Aqueous Technologies). While it discussed cleaning under QFN's in a batch environment, it is also applicable to cleaning u
Electronics Forum | Tue Mar 23 20:55:00 EST 2004 | Dreamsniper
First Time to solder BGA's using Water Soluble. We are currently using an Aquaeous Cleaner to clean our PCB's but I find it not enough to clean the flux from under our BGA's. Has anyone had this experience before that he may like to share how he mana
.gif)
winsouce.jpg)