Electronics Forum | Fri Apr 22 05:01:19 EDT 2011 | azrina
Hi, I am doing my master degree in flux cleaning process for flip chip assemblies and required to establish a new receipt for flux cleaning. currently, i am doing screening process for the parameters involve ; temp,pressure, surfactants, speed and a
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
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