Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Thu Sep 01 11:25:21 EDT 2005 | chunks
Unless it is peppered with via holes. Then it depends on the size of the pad and via holes.
Electronics Forum | Mon Mar 13 06:57:24 EST 2006 | aj
35% and overprint by 3thou on the leads.
Electronics Forum | Mon Mar 13 06:58:05 EST 2006 | aj
overprint by 3 thou on the length of leads only
Electronics Forum | Mon Mar 13 09:14:18 EST 2006 | russ
Thanks A.J. knew about the thermal pad reduction but not the overprint. off to CAD!
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
