Electronics Forum | Wed Apr 15 11:15:42 EDT 1998 | Rick Zak
Have mixed technology board and am interested to hear any info on the Nordson non-contact adhesive dispenser. I woud appriciate any feedback I could get. I am currently using a contact system and am tired of breaking needles and need a way to speed u
Electronics Forum | Sat Apr 18 10:29:47 EDT 1998 | Steve Gregory
| Have mixed technology board and am interested to hear any info on the Nordson non-contact adhesive dispenser. | I woud appriciate any feedback I could get. I am currently using a contact system and am tired of breaking needles and need a way to spe
Electronics Forum | Tue Sep 22 20:08:58 EDT 1998 | Dave Brand
Rick: I'd be happy to give you information on the system benefits and limitations. I work for Asymtek so please email me back so we can talk off-line. Thanks. -Dave Brand | | | Have mixed technology board and am interested to hear any info on the No
Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Thu Apr 01 22:06:58 EST 2004 | Ken
How high a voltage? TV products use hundreds of volts on the vertical and horizonatal sync circuits. Historically, these consumer products were NOT cleaned. For your situation, contact your paste supplier.
Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Wed Apr 26 07:37:52 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi
Electronics Forum | Thu Sep 21 09:45:42 EDT 2000 | Erick Russell
The pyrometer is a non-contact temperature measuring device. It optically measures the surface temperature of the component surface every 10ms.
Electronics Forum | Mon Dec 02 16:01:15 EST 2002 | russ
If you can, attach athermocouple to the locations where you are getting solder balls. A previous product I had showed the same thing and we found that we had inadequate preheat leaving the liquid flux to splatter when it hit the wave. It could aslo
