Electronics Forum: parts fallung off after reflow (Page 1 of 15)

parts popping off during reflow

Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado

We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar

Part drop after reflow

Electronics Forum | Fri Jun 26 14:27:51 EDT 2020 | victorzubashev

Hi Indhu, It could be multiple reasons but probably one root cause. metal nut might require reflow profile change- you need to check it with SMT reflow profiler. the part might be oxidized - you can check solderability or try to solder part using a

Capacitors look rotten after reflow

Electronics Forum | Thu Mar 09 20:55:08 EST 2023 | emeto

It looks like the plating and metalization were stropped off the component. I would suggest these are counterfeit parts. Are these Pb free parts and process?

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette

Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p

BGA drop off from the boards

Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto

Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con

Ni/Sn plated parts

Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01

Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The

warped boarf after reflowing

Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702

Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o

Cleaning after repair.

Electronics Forum | Thu Jan 23 14:19:56 EST 2003 | Mike Konrad

Hi Randy, No-clean flux needs to be activated in order to burn off the volatiles in the flux. This normally occurs partly during preheat and certainly during the reflow or soldering process. In most hand soldering applications, an operator applies

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

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