Electronics Forum: pcb component placement force test (Page 1 of 10)

How to test & measure capacitors/resistors shear force strength

Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz

Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

Impact Value vs Placement Force

Electronics Forum | Thu Mar 15 13:39:06 EDT 2018 | gregp

Impact is the instantaneous force at the time the component first reaches the PCB. F=M*a....so the acceleration is the key factor. If charted on a graph it would look like a spike...higher force for a short duration. The placement force is typical

glue measurement

Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky

I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for

Re: Broken Ceramic SMT parts...

Electronics Forum | Mon Jan 05 16:07:21 EST 1998 | Terry Burnette

| | Hello all, | | I have experienced broken ceramic SMT parts. Most of the time, | | we have found fractured inductive beads. Once in awhile, we find | | broken Ceramic Caps. All parts we use are 1206 form factors and | | we use tape and reel...

MyData Missing Placements

Electronics Forum | Tue Jul 10 11:36:22 EDT 2007 | dyoungquist

Hi SMT Frog We are using an upgraded Mydata TP9-1 system to place 0402s. We do an electrical test plus mechanical centering and use the C14 tool. A few things we have observed/learned: 1) Is the machine not picking the part up out of the tape? Po

QFP rework

Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy

I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has

Re: Trimmer placement.

Electronics Forum | Thu Jul 20 17:03:09 EDT 2000 | Darby

Ketan, If you are using a z-axis head, pay very careful attention to the pick up height so that you don't force the head into the component. Also pay very careful attention to the placement height, we set the component height to 0.05 to 0.1mm over th

CSM 84V: damaged parts (mmelf, 0805) during placing.

Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby

You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest

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