Electronics Forum | Wed Sep 22 09:25:42 EDT 1999 | Wolfgang Busko
| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree
Electronics Forum | Thu Sep 23 17:31:12 EDT 1999 | DaveH
For another excellent vendor try EMC GlobalTechnologies in Pennsylvania (215)340-0650. Contact Marty Wetzel. | | | | | | any thoughs? | | | | | | thanks | | | | | | | | You should use pallets that stand the reflow as well so that no separation wi
Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F
| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha
Electronics Forum | Wed Sep 15 19:01:39 EDT 1999 | DGrenier
| | I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | | | Can anyone direct me to any other supplier? | | | | Are there any particular problems associated wi
Electronics Forum | Wed Sep 15 20:30:57 EDT 1999 | Bach Huss
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Thu Sep 02 14:42:52 EDT 1999 | JohnW
| We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | After wave solderin
Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall
| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so
Electronics Forum | Thu Sep 02 04:12:01 EDT 1999 | Wolfgang Busko
| Certain ICs cannot be place by our pick and place machines and therefore operators place them by hand. Has anyone seen some type of dispensing material handler that would ensure we don't bend the leads of this fragile devices? I'm envisioning some
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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