Electronics Forum | Mon Jun 27 10:45:31 EDT 2005 | franciscoioc
Thank's for the information Bob. I have another question, at the moment my peak reflow is at 218c, this means I am above the 210c a lot of companies run off. If I am building boards using SN63/37 solder paste with lead on my process, and using lead f
Electronics Forum | Mon Aug 08 08:18:52 EDT 2005 | davef
Rob We agree with Jason's point about swab lead indicators. You need to be careful interpreting the results. Lead must be in sufficient measurable quantities as found in Sn 63/37 or Sn 60/40 solders. Handheld units are: * Oxford (bought the X-Met
Electronics Forum | Sat Apr 21 14:50:17 EDT 2012 | edmentzer
We are using SN100C in both our wave and selective machines and have very good results. We also using it for ROHS hand soldering. It flows better than SAC305, the joints are shinny just like Sn63/37. We are looking into using SN100C as our paste b
Electronics Forum | Mon Aug 09 07:37:33 EDT 2004 | C Lampron
Abraham, Lead free components in a leaded process should not be a problem. The problem increases with leaded components in a lead free process. For the most part, the only difference that you will see is in BGA procesing. If a BGA is lead free, the
Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron
EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite
Electronics Forum | Thu Jul 21 23:06:51 EDT 2016 | adamjs
Water washable no-clean flux Hrm, I have not heard of paste that is both of these things (water-wash and no-clean-safe) at the same time, at least not as a solder paste vehicle. Does Kester make one? Can you recommend a particular product (prefer
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Thu Jan 24 16:17:31 EST 2002 | mzaboogie
I have recently been asked to look into some problems that we are having at wave. It is common for us to have unsoldered joints for boards that have SMT parts epoxied to the bottom side. Recently we have had a problem with a gold plated board. The wa
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
| 1 |
