Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Electronics Forum | Fri May 11 14:19:14 EDT 2012 | cyber_wolf
Regarding nano coatings : Nano coatings are susceptible to wear during the printing process and cleaning processes. As they wear they flake off and can potentially contaminate your solder. There is not a lot of independent data available on this so k
Electronics Forum | Wed Sep 25 15:58:36 EDT 2002 | bschreiber
Hello Dave, I hope that electronic slap didn�t hurt too much. Robf, I am sorry that you did not agree with my initial response, but the answer is very detailed and most of the support material I have is only in paper format so I need to either snai
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Thu Jun 15 09:58:12 EDT 2006 | slthomas
Just to add to what dave said, the only limitation to how frequently you clean is the cost of the cleaning medium. You can wipe every board if you want to, but you'll go through material accordingly. If you're printing 16mil pitch or smaller, cleani
Electronics Forum | Tue Oct 11 10:49:14 EDT 2005 | jhagve
HI We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Wed Jun 14 21:49:42 EDT 2006 | davef
Bryan: * Most of our stencils are made from stainless steel that is held by a aluminum frame, attached with epoxy with a fiber glass intermediary between the frame and the stencil. * We use stencils to print either glue [thermoset epoxy] or solder pa
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
Electronics Forum | Mon Jun 19 17:00:39 EDT 2006 | a_laser
The most common rates of in-process cleaning (under wipe) I have encountered are once per 5 to 10 prints. But this depends a on a lot of variables. More often is typically better, but more costly in under-wipe materials. (For some more info see http:
Electronics Forum | Thu Apr 26 13:37:02 EDT 2012 | bobsavenger
I was just wondering what everyone is using for a standard cleaning cycle on their screen printers? I'm sure there a study that I can do on printing but don't have the time currently. Please let me know what everyone is doing as a standard practice
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