Electronics Forum | Wed Sep 22 19:17:14 EDT 2004 | KEN
hand held tachometer. Standard method for process speed verification. Quick, easy and no more tape measures and stop watches! Check your local grainger. They probably have half a dozen makers. I recently bought a dual tach. One end has the roll
Electronics Forum | Sat Jun 11 07:58:17 EDT 2016 | davef
IPC-2252 - Design Guide for RF/Microwave Circuit Boards IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards IPC design standards https://portal.ip
Electronics Forum | Thu Oct 08 07:29:51 EDT 2009 | andrzej
We have 250x340mm panel of PCBs. Stencil for glue would be 0,3mm with about 80 holes mostly for chip components. Our MPM printer at standard set, prints paste on 1 panel at 40-50sec. I need general information if printing glue is faster or slower p
Electronics Forum | Tue Mar 25 07:33:46 EDT 2008 | davef
References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analys
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Fri Mar 04 17:19:31 EST 2005 | davef
Mrduckmann2000: Why do you want to do this? * Removing a non-washable / peelable temporary solder resist [TSR] is going become very tedious, because they do not release well from small / tight / isolated features. * Clay from washable resists will
Electronics Forum | Fri May 09 11:02:00 EDT 2003 | k_h
Thinking about it, if I was designing machines and based on my experience I would offer a high feeder count, high flexibility machine and low speed. In addition another machine with low feeder count, not flexible (8mm parts) and high speed.
Electronics Forum | Thu Apr 30 13:09:53 EDT 2009 | scottp
One factor I see missing is separation speed (or snap off speed). I've run experiments with different pastes where it was the biggest factor in standard deviation of print volume for small apertures.
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