Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
Electronics Forum | Mon Feb 06 10:12:30 EST 2006 | Yash Sutariya
Hi, I authored the presentation so I may be able to help you out with your Q's. 1. IPC is in draft stage for 4 new material specs. These are in the presentation. I would focus on IPC 4101/ 121 and /124. Match your current Tg requirement to the T
Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse
Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15
Electronics Forum | Fri Aug 21 00:27:09 EDT 2009 | boardhouse
Hi To Start Min Tg is just a portion of picking a lead free material, the other is Td. We recommend the following to our Customers. 2-8 layer 150 Tg. Min. / 340 Td. 8-Up. 170-180 Tg.Min. / 340 Td. The above recommendations have been used by man
Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House
Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S
Electronics Forum | Thu Feb 02 09:16:57 EST 2006 | lyrtech
Hi, I have some questions about material used in PCB for RoHS compliancy. It seems to be fuzzy between may manufacturer. Here are my questions: 1) What is the recommended material for lead-free assembly? 2) What's the difference between FR4 High Tg
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Thu Jan 31 09:08:27 EST 2008 | glezfl36
Since the implementation of the ROHS process in our Company with the higher temp requirements, we had observed an increase in problems related to delamination in the PCB's. Actually we are using FR408 and Gracescore materials and are changing to a Ve
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
