Electronics Forum | Wed Sep 13 07:17:32 EDT 2000 | Paul Gerits
Dear Sir, It is possible depending on the exact application. At the moment only way to go direct from die to waffle or PCB is with Hover Davies direct die feeders on Philips EMT (ACM, advanced component mounter), Universal and Siemens machines. This
Electronics Forum | Tue Sep 12 03:36:50 EDT 2000 | PeterB
I have just read that Hover-Davis now manufacture a direct die feeder which can feed directly from wafer to P & P machine compatible with a number of different placement machine manufacturers. Perhaps this will help? Best regards
Electronics Forum | Tue Sep 19 22:12:06 EDT 2000 | rcsantos
Dear Mr. Gerits, Thank you very much for the information. You'd mentioned about Laurier horizontal die feeders, Is Laurier is feeder manufacturer also? Please advise, Best Regards, Raul C. Santos
Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos
Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on
Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89
Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c
Electronics Forum | Tue Feb 06 21:11:27 EST 2001 | Frank
Does anyone know if the Quad ASP machine uses a die wafer feeder manufactured by Laurier. I have experience with the Laurier wafer die handlers and thik they really work well. I am thinking about Quad ASP for a flip chip placement machine. Thanks,
Electronics Forum | Sat Nov 14 14:22:25 EST 2020 | davef
Steve wants to place bare die with the Zeva CT2000. Is anyone doing that?
Electronics Forum | Fri Aug 08 13:31:37 EDT 2008 | RobP
We have a customer that wants us to quote a project placing 12x12 mil dies in large volumes. I can not find feeders for my pick-and-place equipment that will handle wafers with dies that small. Thus, I'm now looking to go to a die sorter to put the
Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1
Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i
Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach
Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos
