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Messtechniklösungen zur Beurteilung und Überwachung der Qualität auf Wafer-Ebene. Prüfen Sie Form, Füllstand und Hohlräume in TSVs durch Silizium-Vias
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
0.15 mm and today's fabrication technology can drill through the board. Unlike 10 years ago when 0.15 mm vias had to be blind vias and required mass lamination
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