Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/316?order=list_price+asc
¥ 0.00 0.0 CNY Finger metal brush (20*70mm) ¥ 0.00 0.0 CNY Finger nylon brush (48*90mm) ¥ 0.00 0.0 CNY vi5k AOI machine ¥ 0.00 0.0 CNY Elbow Air Connector ¥ 0.00
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
(from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of tin-copper forms. This is typically Cu6Sn5 or Cu5Sn6 and this intermetallic is what causes the solder to adhere to the copper pads and leads
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components
. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
Fabrication Quote – Imagineering Back to Imagineering New Quote login Login Create Account Input your PCB fabrication specifications below and
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=1
Fabrication Quote – Imagineering Back to Imagineering New Quote login Login Create Account Input your PCB fabrication specifications below and
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG
