Partner Websites: immersion tin ingredients (Page 1 of 6)

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

Assembly Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0

) Immersion Tin Immersion Silver HASL (Leaded) LF HASL OSP Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.015" 0.020" 0.025" over

Imagineering, Inc.

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

PCB Fabrication Materials | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/

(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

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