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thermal interface”, Applied Thermal Engineering 142 (2018) pp. 346–360 [18] Yeo et al., “Vacuum Reflow Process Characterization for Voidless Soldering Process in Semiconductor Package”, 38th IEEE IEMT Conference, 2018 [19] Ross et al., “Low voiding solder
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ASYMTEK's DV-8000C Heli-Flow® pump is an encoded auger pump with a fixed head designed for high-speed lines of solder pastes, encapsulants, silver epoxies, and thermal interface materials First
