ASCEN Technology | https://www.ascen.ltd/optical_inspection/1073.html
Product Details solder dross recycling machine tin slag recycle system manual : PCB assembly equipment, :2023-12-30 solder dross recycling machine used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1075.html
release.after ten minute,the liquid tin in the tin box will curdle until became the tin bar.the solder dross separator equipment finish the whole solder dross recycling and then the operator can take the tin bar to the wave soldering machine for reuse
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1074.html
release.after ten minute,the liquid tin in the tin box will curdle until became the tin bar.the solder dross recycling equipment finish the whole solder dross recycling and then the operator can take the tin bar to the wave soldering machine for reuse
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. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Some candidates are described below. Pure Tin. Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating
ASCEN Technology | https://www.ascen.ltd/Products/solder_dross_separator/511.html
.Automatic separation of tin and tin ash,into the tin and tin-ash collection device. 3.Separated liquid pure tin automatically stored in the tin cabin,when it is reaches a certain volum, the alarm system turns on,operator just only need discharge the liquid pure tin into molding tray. 4.This
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf