Partner Websites: qfn non-wetting (Page 2 of 40)

4 Common Errors In SMT Assembly - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/

. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals

Blackfox Training Institute, LLC

4 Common Errors In SMT Assembly - Blackfox - Premier Training and Certification

Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/

. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals

Blackfox Training Institute, LLC

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance

ASYMTEK Products | Nordson Electronics Solutions

Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print

: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters


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