ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-faqs
? Recommended storage temperature for solder paste is between 40°F and 50°F (4°C to 10°C). Storage at temperatures above refrigeration will reduce shelf life and voids the guarantee
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
– An epoxy coating that covers the circuits on the printed circuit board. Printed circuit board solder mask color is typically green, but can be substituted for both practical and aesthetic purposes
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
chains or branches called dendrites . These dendrites are electrically conductive, so they can form unintended traces that can lead to current leakage, or even short circuits for extended periods of time
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
... Zoom in on Image FluxPlus Paste Flux Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/102821-jetting-system-and-spray-valves-work-in-harmony-to-protect-led-headlights-from-icing
. In addition, the original conductive ink formulation presented some challenges for jetting. We teamed up with the local fluid formulator to tweak the formulation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/wafer-level-packaging
. Plasma treatment is a viable alternative for dielectric patterning where typical wet processing methods can be avoided. Via Cleaning for WLP - Small vias, formed in the wafer for stacked die applications, often have residue remaining as a result of the via-formation process
GPD Global | https://www.gpd-global.com/co_website/applications-overview.php
volume solder paste, SMT glue, cavity fill, LED encapsulation, stacked die, adhesive dispense, solder mask, conductive ink, edge seal, wafer dispense, high speed glue, gasketing, flux dispense
