| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact EPTAC BLOG J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal Posted on 13th
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process. Can you tell me if there are any specific issues related to vapor phase soldering to immersion tin plated pads on... Question
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process. Can you tell me if there are any specific issues related to vapor phase soldering to immersion tin plated pads on relatively thick multilayer PCBs
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
Heller Industries Inc. | https://hellerindustries.com/intermetallic-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
:20 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
:16 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
