Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2021-07-13 19:51:10.0
Flexible electronics refers to a class of lightweight, flexible and electronic sensing components and electronic devices built on stretchable substrates1 that are used (and can be used) for a broad set of products and applications such as displays and sensors. The most prominent characteristic is that they can bend in contrast to electronic systems built in rigid materials. They are manufactured on flexible plastic substrates, such as polyamide, PEEK2 or transparent conductive polyester films3, or other materials such as paper, textile, or thin glass. The term flexible also refers to the roll-to-roll manufacturing process.
European Commission - Executive Agency for Small and Medium-sized Enterprises (EASME)
Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
Technical Library | 2024-01-08 18:44:00.0
Printed circuit boards, especially multilayer, flexible and rigid-flexible printed circuit boards, are extremely hygroscopic, i.e. they absorb and bind the moisture in the air. A dried polyimide film, for example, will have reached its moisture saturation level again after just a few hours.
Technical Library | 2024-09-02 17:01:54.0
A printed circuit board (PCB) is an integral component of any electronic product and is among the most challenging components to recycle. While PCB manufacturing processes undergo generations of innovation and advancement with 21st century technologies, the recycling of PCBs primarily employs 1920's shredding and separation technologies. There is a critical need for alternative PCB recycling routes to satisfy the increasing environmental demands. Previous work has developed an environmentally benign supercritical fluid process that successfully delaminated the PCB substrates and separated the PCB layers. While this work was successful in delamination of the PCB substrates, further understanding is needed to maximize the interactions between the supercritical fluid and PCB for an optimal processing scenario. As such, this research presents an exploratory study to further investigate the supercritical fluid PCB recycling process by using supercritical carbon dioxide and an additional amount of water to delaminate PCB substrates. The focus of this study is to test delamination success at low temperature and pressure supercritical conditions in comparison to the previous studies. Furthermore, material characterization methods, such as differential scanning calorimetry, dynamic mechanical analysis, and Fourier transform infrared spectroscopy, are included to study the delaminating mechanisms. Results from the recycling process testing showed that the PCB substrates delaminated easily and could be further separated into copper foils, glass fibers and polymers. Surprisingly, the material characterization suggested that there were no significant changes in glass transition temperature, crosslink density, and FTIR spectra of the PCBs before and after the supercritical fluid process.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2021-07-13 19:54:59.0
This Market Trend Report for the Silver Institute examines silver's growing role in printed and flexible electronics. According to our research, 33.9% of the annual silver global supply in 2020 ended up in electronics. This is a total of 327 million troy ounces (Moz) that finds its way into various electronics markets every year. Given the projected growth of electrification, we are confident that this will continue to grow over time since silver is the world's most conductive material.
Technical Library | 2020-02-19 23:12:55.0
Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs.
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Technical Library | 2023-03-13 19:06:53.0
Purpose – There has been increasing interest in the development of printable electronics to meet the growing demand for low-cost, large-area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic application of novel printable materials. Design/methodology/approach – The paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen-printing, ink-jet printing, and microcontact printing provides a fully additive, non-contacting deposition method that is suitable for flexible production.
Technical Library | 2021-08-18 01:24:20.0
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
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