Technical Library: research (Page 1 of 9)

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes

Technical Library | 2013-07-03 10:31:54.0

It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.

BEST Inc.

Innovation Through Iteration

Technical Library | 2024-09-30 15:30:31.0

A brief article about the research and development process.

A-Laser, Inc.

Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet

Technical Library | 2007-01-17 13:08:35.0

Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies.

Washington State Magazine

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Technical Library | 2010-06-10 21:01:48.0

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.

KYZEN Corporation

New Methods of Testing PCB Traces Capacity and Fusing

Technical Library | 2011-11-25 16:07:47.0

The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a

UPB-CETTI University of Bucharest, Center for Technological Electronics and Interconnection Techniques

Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys

Technical Library | 2016-02-18 18:55:09.0

As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.

AIM Solder

Global Recycled Plastics Market Is Growing With a CAGR of 4.5%

Technical Library | 2021-12-20 13:28:58.0

Research Nester, in its repository of market research reports, has added a report on the topic "Global Recycled Plastics Market", which is studied for the forecast period, i.e., 2021-2028. The report includes a brief analysis of the key players operating in the market, along with their latest developments. The report also focuses on the latest market trends, along with the opportunities and the drivers that are expected to drive the market growth during the forecast period.

Research Nester

Three-Dimensional MMIC and Its Evolution to WLCSP Technology

Technical Library | 2012-01-19 19:14:49.0

The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an

Sumitomo Electric Industries, Ltd.

Accurately Capturing System-Level Failure of Solder Joints

Technical Library | 2020-02-05 18:20:06.0

Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..

DfR Solutions (acquired by ANSYS Inc)

Oncology Information System Market Is Expected To Register a Notable CAGR of ~7%

Technical Library | 2021-12-27 13:28:49.0

Research Nester published a report titled "Oncology Information System Market: Global Demand Analysis & Opportunity Outlook 2030" which delivers a detailed overview of the global oncology information system market in terms of market segmentation by product, software, end-user, and by region.

Research Nester

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research searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

High Throughput Reflow Oven
Circuit Board, PCB Assembly & electronics manufacturing service provider

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Solder Paste Dispensing

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Sell Your Used SMT & Test Equipment

Wave Soldering 101 Training Course
PCB Depanelizers

"Find out how you can receive priority in SMTnet Search with out Sponsor membership."