Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2019-12-05 13:30:46.0
Conformal coatings are regularly employed to protect the surface of a soldered printed circuit board assembly from moisture, chemicals in the PCBA's service environment, and foreign objects or debris. Conformal coatings are nonconductive and therefore cannot be placed on any location where electrical contact will be required, such as connector pins, test points, and sockets. Conformal coatings are also not permitted on any mechanical interface location, such as mounting holes or brackets, to assure the proper fit between items in the final assembly. In order to apply conformal coatings to an assembly and comply with the restrictions on keep-out areas, masking is employed to protect those surfaces.
Technical Library | 2019-08-08 10:23:51.0
High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation.
Technical Library | 2020-04-14 16:00:20.0
The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.
Technical Library | 2019-06-06 13:40:47.0
Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
