Technical Library | 2023-09-15 11:14:33.0
Optimize your inventory management with our SMD SMT X-Ray Offline Component Counting Machine. Ensure precise and efficient component counting with advanced X-ray technology. Enhance your operational efficiency and inventory accuracy for SMD and SMT components. Explore how this machine can revolutionize your component counting process and streamline your operations.
Technical Library | 2009-04-23 08:14:37.0
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result.
Technical Library | 2023-11-20 18:18:34.0
When x-ray inspection is used as part of a quality assurance program for any assembled device, steps must be taken early in the design stage to anticipate the use of x-ray inspection later in the development and production processes. This is a lesson that electronic assembly manufacturers learned years ago, and that medical device manufacturers are also discovering. There are several steps involved in learning how to interpret x-ray images, and how to design for x-ray inspection. First, manufacturers need to understand the nature of the x-ray shadow and its modalities; then they need to see how medical device developers and manufacturers are using x-ray inspection; finally, they need to consider taking measures early in the design process to ensure a clear, accurate image when the assembled device undergoes x-ray inspection.
Technical Library | 2023-11-20 17:30:11.0
Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Technical Library | 2020-05-26 22:28:56.0
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
Technical Library | 2022-10-04 16:43:10.0
In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2014-12-18 17:22:34.0
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critical part of electronics manufacturing. In this project, we focus on how to use AXI to identify BGA Head-in-Pillow (HIP), which is challenging for AXI testing. Our goal is to help us understand the capabilities of current AXI machines.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
