Used SMT Equipment: bga self align (Page 1 of 4)

Samsung SM421F

Samsung SM421F

Used SMT Equipment | Chipshooters / Chip Mounters

Make:  Samsung Model: SM421F Vintage:  2012 Details: (4) Spindle Head Assembly “On The Fly” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separatel

Lewis & Clark

Samsung SM320 Chip Mounter

Samsung SM320 Chip Mounter

Used SMT Equipment | Pick and Place/Feeders

Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed :18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co

Qinyi Electronics Co.,Ltd

Ekra X5 Professional Large

Ekra X5 Professional Large

Used SMT Equipment | Screen Printers

EKRA X5 Professional Large, Screen and Stencil Printer Type: X5 Prof Large Serial Nr.: 805843 Year of Manufacture: 2014 Direction: Left to Right Voltage: 400V, 50/60Hz, 3 Phases Air Pressure: 6 Bar Printing Area: min.: 80x50mm, max.: 660x550mm Printe

smtXtra

DEK automatic solder paste printing machine

DEK automatic solder paste printing machine

Used SMT Equipment | Pick and Place/Feeders

DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde

KingFei SMT Tech

Manncorp MC385V2-V

Manncorp MC385V2-V

Used SMT Equipment | Pick and Place/Feeders

Manncorp MC385V2-V Pick and Place Vintage: 2014 Details:   Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH

Lewis & Clark

Manncorp MC385V1-V

Manncorp MC385V1-V

Used SMT Equipment | Pick and Place/Feeders

Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability

Lewis & Clark

SRT Summit 2100RD

SRT Summit 2100RD

Used SMT Equipment | Repair/Rework

● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an

Capital Equipment Exchange

Speedline Accuflex

Speedline Accuflex

Used SMT Equipment | Screen Printers

MPM Speedline ACCUFLEX Screen Printer - Refurbished Model: Accuflex Vintage: 05/2005 2D post inspection Rotary Pin Placement Option Pressure Feedback Control Squeegee Head Underwipe Stencil Cleaner Fiducial Recognition fo

Recon Inc

Speedline Accuflex

Speedline Accuflex

Used SMT Equipment | Screen Printers

MPM Speedline ACCUFLEX Screen Printer - Refurbished Model: Accuflex Vintage: 04/2005 2D post inspection Rotary Pin Placement Option Pressure Feedback Control Squeegee Head Underwipe Stencil Cleaner Fiducial Recognition for Stencil to PCA Align

Recon Inc

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Multi-Fuction Placer With LCS Available! 4 Standard Change Heads & 4 FNC Heads Component Range:  0201 to 32mm Square   Placement Rate:18,000CPH (Chips), 2,500 (QPP)    Maximum Board Size:  460mm x 440mm (18.1" x 17.3")  

Thinking Productivity Inc

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