Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Flexible Mounters
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3RA Detailed product introduction Electric/mechanical belt feeder can be thesame with models Characteristic： Chip components 90000CPH (0.040 sec / chip, optimumcondition) 66000CPH: chip (in accordance with theIPC9850 standard
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-3RA high speed modular chip mounter Product number: FX-3RA Detailed product introduction Electric/mechanical belt feeder can be the same with models Characteristic： Chip components 90000CPH (0.040 sec / chip, optimum condition)
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-L2 chip mounter Product number: Samsung DECN-L2 Detailed product introduction By using Vision Head 12Flying to achieve the highest speed 82000CPH Through the flight identification method, the placement of the head movin
Used SMT Equipment | SMT Equipment
Product Name: FX-3RA high speed modular chip mounter Product number: FX-3RA Detailed product introduction Electric/mechanical belt feeder can be the same with models Characteristic： Chip components 90000CPH (0.040 sec / chip, optimum condition)
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | SPI / Solder Paste Inspection
SPI PARMI SPI HS60L PARMI solder paste inspection machine SPI HS60 product introduction: 1. The SPI HS60 Series series is PARMI's best-selling model. It has been installed in excellent SMT production sites around the world. Its performance st
Used SMT Equipment | Pick and Place/Feeders
Concept: Over drive motion Ultimate access Super wide range DDH V5 Smart operation Voluntary line operation Wide open &Easy access Quick exchange Auto changeover PP type LISA Feeder hot swap Chip theory speed 84500chip Placement ra
