Used SMT Equipment | SMT Equipment
Product name: KE2050M JUKI chip mounter Product number: KE2050M Products in detail SMT speed: 13200 CPH (laser identification) The laser head1 (4 nozzle) Patch area: 0603 (0201) inch chip ~ 20 mm square element, or 6.5 * 11 mm; 0402 (01005) in
Used SMT Equipment | SMT Equipment
Product name: KE2050M JUKI chip mounter Product number: KE2050M Products in detail SMT speed: 13200 CPH (laser identification) The laser head1 (4 nozzle) Patch area: 0603 (0201) inch chip ~ 20 mm square element, or 6.5 * 11 mm; 0402 (01005) in
Used SMT Equipment | SMT Equipment
Product name: YSM20 efficient module chip mounter Product number: YSM20 Products in detail Features: A wide range of support and efficiency of the various production form With products at the same level of the world's most rapidly does unive
Used SMT Equipment | Pick and Place/Feeders
JUKI Chip Mounter – KE 2050M The best system for high-speed placement of small components. As part of a “modular concept”, the KE-2050 can be the base of a flexible placement system line designed specifically to meet the require
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | Pick and Place/Feeders
Model Name: YSM20R 5% faster than the YSM20. Featuring a new wide-scan camera with improved component adaptability Applicable PCB: PCB conveyance : L810 x W490 to L50 x W50 2 PCB conveyance : L380 x W490 to L50 x W50 Mounting capability: X axis 2
Used SMT Equipment | Pick and Place/Feeders
JUKI KE-2080 Pick and Place Machine Since entering the electronics industry equipment field in 1987, JUKI has pioneered a new field with its original modular mounters that match the production innovation required by the electronics industry. The comp
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
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