Used SMT Equipment | Soldering Equipment/Fluxes
2003 VITRONICS - SOLTEC MySelective 6748 Selective Solder Dimensions: 91" x 82" x 80" Serial: _0312722701 Features: External X-Y Spray Fluxer, Multiwave Pot, Wave Height Measurement System, Combined SelectWave and MultiWave Soldering Technology,
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational
Used SMT Equipment | SPI / Solder Paste Inspection
Description: 3D Solder Paste Inspection System Vintage: 2016 O/S: Windows 7 Ultimate Details: • 4-Way High Speed Projection Upgrade (for KY8030-3) 3D Inspection GUI, Gerber conversion software • SPC Plus software(Statistical P
Used SMT Equipment | SPI / Solder Paste Inspection
Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins
Used SMT Equipment | SPI / Solder Paste Inspection
Very Nice Cyberoptics LSM For Sale in Good Working Conditon See attached pictures and information below. •Cyberoptics •Model Number: LSM/LRGE-110 •Serial Number: 5718 •Year December 1994 •Type:Laser Section Microscope •Measures Solder Paste H
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Used SMT Equipment | Visual Inspection
Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
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