Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2019-11-05 22:25:21.0
Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2010-04-11 04:37:13.0
Christopher Associates Inc. announces the introduction of the CSL-A25T Cut Sheet Laminator from C Sun Manufacturing Company. C Sun, Asia’s largest manufacturer of imaging, curing, and photo resist lamination systems, developed the CSL-A25T for flexible and thin core substrates.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
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